FINNED CHANNEL OPTIMIZING IN RADIO ELECTRONIC DEVICES FOR FORCED AIR COOLING SYSTEMS
DOI:
https://doi.org/10.15588/1607-3274-2014-2-5Keywords:
finned channel, thermal model, thermal resistance, forced air cooling, computer-aided engeneering systems, electronic equipment.Abstract
The finned channel is used as a simplified model for the analysis of thermal conditions of cartridge design electronic equipment witha high power density for forced air cooling. The finned channel thermal model and method of its creating are described by the computeraided
engineering systems. Clearance limitations of the radio electronic units and the manufacturing limitations on width of fins and their numbers are considered during creating the thermal model. The finned channel thermal characteristics that include the thermal resistance dependence on parameters of fins (width, length, number) are investigated. The approximating functions for these dependencies are proposed. To minimize the thermal resistance the correlations for finned channel having the optimal sizes are obtained. The iteration optimization algorithm is developed. This approach provides high accuracy. In the algorithm the thermal conditions are calculated by the computeraided engineering systems. The example of designing the finned channel with optimal thermal conditions is showed. As a result of optimizing the finned channel thermal resistance decreased by 35 %.
References
Ненашев А. П. Конструирование радиоэлектронных средств / А. П. Ненашев.– М. : Высш. шк., 1990. – 432 с. 2. Дульнев Р. Н. Тепло- и массообмен в радиоэлектронной аппаратуре / Р. Н. Дульнев. – М. : Высш.шк., 1984. – 247 с. 3. Пат. 13704 Україна, МПК G01S 7/36 H04B 15/00. Пристрій для подавлення пасивних завад / Каспирович О. Г., Лаврентьєв В. М., Май І. Д., Пресняк І. С.; заявник та патентовласник КП «НВК «Іскра» № u200509636; заяв.13.10.2005; опубл.17.04.2006, Бюл. № 4, 2006. 4. Ройзен Л. И. Теловой расчет оребренных поверхностей / Л. И. Ройзен, И. Н. Дулькин; под. ред. В. Г. Фастовского. – М. : Энергия, 1977. – 256 с. 5. Drofenik U. Analysis of Theoretical Limits of Forced-Air Cooling Using Advanced Composite Materials With High Thermal Conductivities / U. Drofenik, A. Stupar, J.W. Kolar // IEEE Transactions on Components, Packaging, and Manufacturing Technology. – 2011. – Vol. 1, № 4. – Р. 528–535. 6. Алямовский А. А. Инженерные расчеты в Solid Works Simulation / А. А. Алямовский. – М. : ДМК Пресс, 2010. – 464 с. 7. Гончаров П. С. Практическое использование NX / П. С. Гончаров, М. Ю. Ельцов, С. Б. Коршиков, И. В. Лаптев, В. А. Осиюк. – М. : ИД ДМК Пресс, 2010. – 504 с.
Downloads
Published
How to Cite
Issue
Section
License
Copyright (c) 2015 V. N. Krischuk, G. N. Shilo, N. A. Kaspyrovych, E. V. Ogrenich
This work is licensed under a Creative Commons Attribution-ShareAlike 4.0 International License.
Creative Commons Licensing Notifications in the Copyright Notices
The journal allows the authors to hold the copyright without restrictions and to retain publishing rights without restrictions.
The journal allows readers to read, download, copy, distribute, print, search, or link to the full texts of its articles.
The journal allows to reuse and remixing of its content, in accordance with a Creative Commons license СС BY -SA.
Authors who publish with this journal agree to the following terms:
-
Authors retain copyright and grant the journal right of first publication with the work simultaneously licensed under a Creative Commons Attribution License CC BY-SA that allows others to share the work with an acknowledgement of the work's authorship and initial publication in this journal.
-
Authors are able to enter into separate, additional contractual arrangements for the non-exclusive distribution of the journal's published version of the work (e.g., post it to an institutional repository or publish it in a book), with an acknowledgement of its initial publication in this journal.
-
Authors are permitted and encouraged to post their work online (e.g., in institutional repositories or on their website) prior to and during the submission process, as it can lead to productive exchanges, as well as earlier and greater citation of published work.